LESSON1 Operational safety confirmation
1.Safety precautions:
1)Machine operators must receive professional safety training and master safe and correct operating methods.
2)Under any circumstances, it is necessary to first cut off the power supply of the machine for maintenance (press EMG) .
3)Do not allow any part of the body to enter the operating range of the machine during operation.
4)The safety device of the machine must always be in a bootable state.
2.Confirm various safety devices:
1)Emergency stop button EMG - front and rear of machine body, ATS, etc
2)Area Sensor AREA&Feeder Detection Sensor - On both sides of the machine front.
3)Cover INTERLOCK Switch - The front and rear covers of the machine, as well as the doors of the ATS.
3.Several forms of shutdown:
1)Press EMG, the machine cannot run, and the servo motor is in OFF state (red light on).
2)The area sensor is activated, the machine cannot run, and the servo motor is in the ON state (yellow light)
3)The interlocking device is activated, the machine cannot run, and the servo motor is in the ON state (yellow light).
4)Directly stop the machine. During the production process, press the STOP key or space bar, and the machine will not run. The servo motor will be in the ON state (yellow light).
5)Error shutdown, caused by incorrect MARK point identification of components or substrates, as well as issues with component extraction (lack of data&poor FEEDER). The machine cannot run, and the servo motor is in the ON state (yellow light flashing).
6)Cycle Stop Cycle Stop. During the production process, activate the Cycle Stop button on the screen. Wait for the machine to complete the current task before stopping (it cannot be stopped immediately). The machine cannot run and the servo reaches the ON state (yellow light).
LESSON 2 Inspection items before production
1) Is the current air pressure value normal?
YAMAHA YV100Xg standard value :0.55+/-0.5Mpa
2)Has the emergency stop device been deactivated?
Attention: It is necessary to check the safety before releasing the safety device.
3)Is the positioning of the track and substrate OK?
Is there any foreign object on the track, and the various parts of the conveyor system will not collide with each other during operation (such as SUPPORT PIN and track)? Is the substrate positioning method appropriate?
4) Is the state of the mounting head normal?
A. Is NOZZLE installed correctly
B.Is the sensor status normal?
5)Is the FEEDER installed correctly?
A.Inspection of materials;
B.Check status of installation position of FEEDER;
C.Includes the TRAY check.
LESSON 3: Power on
1)Confirm safety and conduct inspections against LESSON1 items.
2)Turn on the power, load the necessary operating programs on the machine, and check against the items in LESSON2.
3)Perform origin reset Every time the power is turned off and the machine is restarted, it is necessary to return to the original point.
4)Specify a username to log in (Different users can be specified to log in and use the machine based on pre-set operation permissions).
5)Perform warming up. The warm-up time can be set as needed. The recommended warm-up time should be at least 10 minutes.
LESSON 4 Master basic operations
1.Introduction to ammonium buttons and peripherals on the machine.
2.Understand the basic composition of the YAMAHA program operation screen.
3.Introduction to the SETUP Main Interface.
4.SETUP-Utility Introduction(一)
1).Origin: All moving parts of the machine return to the origin (motor return to zero point).
2).Warming Up: Machine warming up.
3).Cycle Stop
4).Conveyor Out Stop: Stop after removing the substrate.
5).Halfway Continue: Due to a midway shutdown, production will continue.
6).Tray Count: Set the current suction position from the TRAY disc.
7).Feed Bulk: The usage status of vibration feeders.
5.SETUP-Utility Introduction (二)
8).Required Parts(Required material list)
9).Required Nozzles (Demand NOZZLE information)
10).Nozzle Check:Nozzle Condition check.
6.SETUP-Utility Introduction (三)
11).Setting of STEP machine production cycle action flow.
12).History: Specify that production information needs to be displayed.
13).Soft setting: Settings for input methods, relevant information storage locations, and user permissions.
14).SW vision: View version information of YAMAHA.
LESSON 5 Build the data of the substrate(Create a program)
1.Component Installation Program Compilation Process.
2.Composition of substrate data:
1.Create the substrate name
1) Direct creation method: Enter the name of the substrate and determine its properties (and extension).
2) Copy modification method: Call the original program and only modify some parameters in the substrate (For different versions of the same product, programming can save time and improve program execution.)
3) Explanation of XML, VIOS, TXT attributes.
A.XML format developed by YAMAHA WINDOWS
Operating system. Enhanced graphics display function.
B.VIOS used to operate the YAMAHA DOS operating system and is compatible with the current YAMAHA WIDOWS system.
C. TXT is often used for program backup and cannot be directly used in production, requiring conversion.
2. Input substrate information (Description of some functional items:)
1).Prod. Board Counter:Specify the quantity of substrates that have already been produced.
2).Prod.Board Counter Max:Set the planned total production quantity.
3).Prod. Block Counter:When producing connecting boards, define the quantity of several small boards on a large board.
4). Unloader Counter: Specify the number of substrates that have passed the UNLOADER.
5). Unloader Counter Max: Set how many pieces of PCB can be placed in a box of UNLOADER at once.
6). Board Fix Device:
Edge Clamp---Edge Clamp+ PushIn + PushUp Pin
Locate Pin---Only using “Locate Pin” for secured PCB
Pin+PushUP--- Locate Pin +PushUp Pin(Recommend method)
7). Pre. Fix Timer sec: When the PCB DETECTION SENSOR senses the PCB, it takes a long time to clamp the PCB.
8). Trans Height: When the production substrate consists of two panels and there are spare parts on the back, in order to avoid interference with spare parts due to insufficient PUSHUP PIN reduction, the PUSHUP PIN reduction distance is set here.
9). Conveyor Timer sec: For some irregularly shaped substrates.
When SENSOR senses its last edge, a late CONVEYOR is required
The transfer time of MOTOR is necessary for it to flow out of the machine normally.
10). Retry Sequence: GROUP— When there is an abnormal recognition of a hair during a certain installation, wait until all eight suction heads have been installed, and then use this installation head to re suction this component.
BLOCK----When a certain patch of hair has recognition abnormalities, wait until all the BLOCK (or BOARD) patches are completed, and then use this patch head to re extract.
ATUO----When there is an abnormal recognition of hair in a certain patch, wait until all the BLOCK (or BOARD) patches are completed, and then use the idle patch head to re draw.
11). Precede Check: Whether to use the early suction function (Increase production rate)
12). Tray Priority: When using TRAY material production, enable this function to timely extract the material from TRAY based on its supply situation.
LESSON6 Building component information
1.BASIC function Description
1.BASIC function Description
1). Alignment group: Identify the category of components.
2). Alignment:Identify the type of component.
3). Required Nozzle:NOZZLE model used.
4). Package: Component packaging type.
5). Feeder Type:Types of FEEDER usage.
6). Dump Way:Disposal location
7). Retry Time:Number of times to reabsorb.
8). Database NO:Call the number of the component library.
1.PICK item function description
1).Position Definition:Definition of suction position for FEEDER.
2). Pick Up Angle: Clockwise direction indicates a positive increase, while counterclockwise direction indicates a negative increase. The original 0 degree is usually considered as 0 degree in the long side of the material in the FEEDER.
3). Pick Height: Absorb high levels When NOZZLE TIP comes into contact with the upper surface of the ribbon, it shows a positive increase from 0 to 0.
4).Pick Timer: Time to pause when the chip head drops to the lowest specified position for the suction component.
5).Pick Speed:Move the chip head to the designated position (above the FEEDER) to reduce the speed of the suction component .
6). XY Speed: The speed of XY movement of the pasting head .
7)Pick&Mount Vacuum Check: Whether to perform vacuum value detection.
NORMAL CHECK:Commonly used to determine whether a component is absorbing by changing the vacuum value during component absorption.
SEPCIAL CHECK:Selecting this option can accurately determine abnormal component suction, but it will increase the suction time of the component, which is not commonly used.
(NOTE: The above VACUUM CHECK is only valid if the VACUUM CHECK item in the substrate information is enabled)
IGNORE:Vacuum value absorbed by non detecting components.
8.Pick Vacuum(%):Determine the vacuum value ratio of the suction component (Relative to the machine parameter MONITOR LEVEL, how much downward is it? This means that the suction element is considered normal.)
9).Pick Start: Specify the time for vacuum to be turned on.
NORMAL—Lower the mounting head to a certain height and open the VACUUM VALVE.
BOTTOM—Wait until the mounting head drops to the specified lowest position and touches the component body before opening the VACUUM VALVE.
10). PICK ACTION: Specify the action of extracting (or attaching) components downwards.
NORMAL---For general components, it is usually used (Normal speed and acceleration)
QFP---Suitable for QFP, BGA, and components larger than 32 * 32MM that use MULTI CAMERA identification. Ensure the installation accuracy and protection of components.
FINE---Suitable for QFP, BGA, and components with dimensions greater than 32 * 32MM and identified by SINGLE - CAMERA. Ensure the installation accuracy and protection of components.
DETAIL—Make more detailed settings for the PICK ACTION action. After enabling this function, the following PICK TANGO; The PICK DOWN and PICK UP functions can only be modified.
11).PICK TANGO:NORMAL—Usually use TROL - suitable for high-precision micro component mounting.
12).PICK DOWN:No use of this function (DEFECTIVE)
13).PICK UP:No use of this function (DEFECTIVE)
3. MOUNT Function Introduction
1). Mount Height:Set the distance for pressing down the mounting head (Down is positive, up is negative).
2). Mount Timer:The time when the mounting head and mounting components remain at their lowest point.
3).Mount Speed & XY Speed:
Same as Pick Speed (NOTE: When changed here, the corresponding parameters of Pick also change at the same time)
4）.Pick&Mount Vacuum Check//Mount Vacuum%//Mount action//Mount Tango// Mount Down//Mount Up: ((Please refer to the PICK function item description for annotations)
4.Introduction to VISION function items
1).Alignment module Fore&back:Specify the method for identifying components, usually selecting both.
2).Light Main& Coaxial & Side:Control of identifying light sources. Select different light sources based on different components. Usually, only Light Main&Coax is used, while Light Side only recognizes BGA and can detect it for cracks.
3). Lighting Level:Light brightness.
4).Comp Threshold:Determine the gray ratio of identification components .
5).Comp Tolerance:Allowable recognition error.
6).Search Area:Search range for component pins.
7).Datum Angle:Define component angles using.
8).Comp. Intensity:Component light intensity.
9).Multi MACS: (Option)
5.Shape Function Introduction
1). Alignment Group:Identify the overall category of components.
2). Alignment type:Identify the type of component.
3). Rule Offset:Due to non-standard component shape when identifying components.When calculating the size of a graph, it is allowed to subtract a certain compensation value inward.
6.Tray & Option Function information
A.Tray
1). Package: Packaging method of components
2). Feeder Type: FEEDER Model
B. OPTION
1). Alternative:Set the replaceable material station number.
2). Parts.Group NO:Distinguish the installation order of components.
3). Use Feeder optimize:Whether to allow the station of this station data to be rescheduled during program optimization.
Try editing a component
A: Function item introduction
1). EDIT
2). ROW EDIT bar management
3). Jump selection
4). TECH suction position adjustment
5). Adjust component parameter comprehensive adjustment.
B: Edit a component method (order)
Create a component name, add a solution to the component, set the component parameters, check the component suction position, and adjust the component parameters comprehensively (ADJUST). Save the settings now.
C: Hands on operation: Take any material, correct parameters based on the actual situation of the material, and perform machine recognition.
LESSON 7 Establish MARK information
1.Basic& Shape Function item introduction
A. Basic
1).Mark type:Use type
2).Database No:Calling MARK points
Database number
B.Shape
1). Shape type:MARK shape type
2). Mark Out size:Peripheral dimensions of MARK points.
2. Vision Function item introduction
1).Surface Type:Mark's surface type
2).Algorithm Type:Normally, the NORMAL operator is chosen.
3).Mark Threshold:Grey ratio
4).Tolerance:Acceptable error range
5).Search Area X&Y:Search scope for Mark points
6).Outer Light//Inner Light//Coaxial Light//IR Outer Light// IR Inner Light:Specify the detailed MOVING CAMERA light source brightness
7).Cut Outer//Inner noise: When recognizing MARK points, there are external or internal image defects。
8).Sequence:Determine the speed of identifying MARK points
NORMAL----Generally used
QUICK------Quickly identify and improve the recognition speed of MARK points
FINE----Used to improve the accuracy of MARK point recognition under high precision conditions.
3.Try editing a MARK (reference point) and identifying it
A. Function item introduction
1). EDIT
2). ROW EDIT Column management
3). Jump bar selected
4). Adjust Parameter comprehensive adjustment
B: Edit a component method (order)
Enter the name of the MARK and add the solution. Set the MARK parameters. Check the MARK position (the coordinates of the MARK need to be established in the PCB information). Adjust the MARK parameters comprehensively (ADJUST) and save the settings
C: Hands-On Activities: Take a sample and try to edit it into BOARK MARK, BLOCK MARK, BAD MARK and perform machine recognition。
LESSON 8 Establish mount information
1.MOUNT information
OFFSET information
1).Board origin:
Machine default substrate
Locate Pin is the origin (0,0)
In the actual production process,
To facilitate program editing and
data interchangeability requirements,
the bottom left corner of the substrate is set as ORIGIN.
Now Board Origin Coordinates is (-5,-5),
2). Block R angle:Clockwise is positive and vice versa is negative (0,90,180,-90)
* When BOARD ORIGIN is not equal to LOCATE PIN POSTION
*Simulated template teaching (calculating Board Offset&Origin)
3.Fiducial (reference point) information
1).EDIT function: whether to use or not to use a certain benchmark.
2) .The selection of the TYPE option: "Local, Point, 4Local M, 4Local S" is an explanation of the positioning purpose when positioning local components
3).For Local Fiducial, only one reference point can be set. Additionally, setting "0" for X2, Y2, and MARK2 will not be used by default.
4.Bad Mark information
NOTE: BAD MARK can be set according to the situation, which of the three types belongs to: BOARD, BLOCK, and LOCAL.
LESSON 9 Edit a simple substrate program and perform installation
1.Compile the substrate program;
2.Adjustment of the conveying device (correctly clamping the substrate onto the track);
3.Confirm relevant information such as materials and suction nozzles;
4.Check if the suction position is appropriate;
5.Set production speed;
6.Execute production;
7.Check the condition after installation.
LESSON 10 Generate linked board data and proceed with the installation of the second board
1.If the data of the first substrate is correct, input the FIDUCIAL information of the second board
2.Enter the OFFSET information for the second board
3.Confirm the position of the substrate and proceed with installation.
4.Check the condition after installation (correction)
LESSON 11 Implement program optimization
1). Nozzle Settings
FREE —Not specified
CURRENT-Use current settings
EDITING —Formulate
2).Feeder settings
No—No optimization for secondary terms
All Feeders Fixed—The current setting remains unchanged
No Set Pos Feeders move—No optimization specified
Move within table—Allow optimization within the same table
All Feeders Move—Optimize everything
Move+Fixed Data Match—Mobile and immutable reference program designation
3).Order of execution optimization (Procedure)
A.Select a program
B.Expand data within the EDIOR function item
C. Save the expanded program
D.Select the expanded program again through the Optimize option
E. Set optimization conditions(NOZZLE,FEEDER etc.)
F.Save settings for optimization conditions
G.Execution optimization
H.Check the scrambling results and save the data
LESSON 12 Introduction to Other Common Items—“MONITOR”
1.MAIN
2.Detail
3.Vision
4.Alignment
5.Retry
Introduction to MIS Items
1.Error Log 2.Board Log 3.Program Log
Introduction to Unit Log
1).HEAD
2).NOZZLE
3).FEEDER
4).CONVEYOR
5).PARTS
NOTE:Classify and calculate the quantity and rate of defects generated by each component.
UNIT Item Introduction
1).Conveyor,Head Feeder,ATS,I/0.
2).Common items include substrate fixation, NOZZLE exchange, FEEDER inspection, and individual movement of the machine's moving parts (beneficial for inspection and troubleshooting).
Introduction to HELP items
LESSON 13 Related data backup
1.Backup of production programs
2.Database
1).BACKUP: Data backup (out)
2).RESTORE: Data call (in)
3).NOTE:
All the sets of the parts and mark database are execute after board reading
3.Machine parameter backup
1).FORMAT: format a floppy disk
2).BACKUP: Data backup (out)
3).RESTORE: Data call (in)
LESSON 14 Machine Daily repair and maintenance (DAILY PM)
1.Check the status of NOZZLE and clean it;
2.Clean delivery platform;
3.Check the status of strip withdrawal;
4.Check and clean the COVNEYOR system;
1).Belt, pulley, sensor, etc
5.Clean CAMERA. Clean dust and dirt.
