The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed.
SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process.
In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
SMT printing collapse refers to the collapse of solder paste on PCB pads without forming. Common causes and countermeasures are as follows：
Reasons:
Solder paste is printed onto PCB pads through the steel mesh and scraper of the solder paste printing machine, and the reason for collapse is due to the strong fluidity of the solder paste, which is caused by insufficient viscosity of the solder paste.
The strong fluidity and insufficient viscosity of solder paste are mainly due to excessive stirring, resulting in a decrease in viscosity. On the other hand, the solder paste itself has fewer components and thickeners.
Countermeasure:
The best condition is to ensure normal heating time of the solder paste, stir evenly, and the solder paste can continuously infiltrate when lifted up. In addition, higher viscosity solder paste should be used.
Regarding SMT Printing related knowledge, KINGSUN share with you here , hoping to be helpful to you. More information about Products please Contact US at [email protected] or visit www.ksunsmt.com .
