YS100 high speed universal module chip mounter

Product name: YS100 high speed universalmodule chip mounter

Product number: YS100

Products indetail                                   

The characteristics of

25000 CPH (equivalent to 0.14 seconds/CHIP:best conditions) ability of high speed SMT

All the time, SMT absolute accuracy + 50microns (CHIP), plus or minus 30 microns (QFP)

Configurable CHIP ~ 0402-45 mm longelement, wide range of joint element

15 mm object element corresponding level

L size base plate

(L510 x W460mm)

Built-in cut of corresponding main bodywith options

Comply with CE safety specifications (ECmachinery directive and EMC directive)

Model: YS100 (model: KJJ - 000)

Object substrate: L50 * W460mm W50mm ~ L510(note 1) (note 2)

SMT efficiency (best conditions) 25000 CPH(equivalent to 0.14 seconds/CHIP)

SMT precision: (the company standardcomponents) absolute accuracy (mu + 3 sigma) : + / - 0.05 mm/QFP/CHIP, plus orminus 0.05 mm

Repeat accuracy (3 sigma) : + / - 0.03mm/QFP/CHIP, plus or minus 0.03 mm

Object components: 0402 (mm) - - 45 mmcomponents, SOP/SOJ, PLCC, QFP, joint, CSP/BGA, long joint (below W45 x 100 mmL) element can be pasted on the height below 15 mm

Element types

126 (maximum/conversion into 8 mm tape)(note 1)

87 (maximum/conversion into 8 mm tape, whenassembling sATS)

Power specifications: three-phase AC200/208/220/240/220/240/416 V + 10% for 50/60 Hz

For the gas source: more than 0.45 MPa,clean and dry condition

Overall dimensions

L1, 665 x W1, 665 (flat side) x H1, 445 mm(cover plate above)

L1, 665 x W1, 665 (batch replacement carguide side) x H1, 445 m above (cover)

Body weight: about 1630 kg (only body)